WAKI Factory Inc.

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WAKI Factory Inc.
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Technologies
O-FLEX
Another achievement by collaboration with Shikazono Laboratory is the new technology for heat transfer enhancement. By adding a new geometry that minimizes the pressure drop on the conventional fin (heat-transfer enhancement by concavo-convex protrusions), we have realized high performance in heat conductivity, drainage, and dust resistance. The oblique wavy protrusions on the finless heat exchanger improve air side heat transfer coefficient further as well as the pressure resistance against the internal pressure of cooling air conditioning. The joint patent by Professor Shikazono of the Institute of Industrial Science (IIS), the University of Tokyo and Waki Factory Inc. (Pat.No5082129)
  • A mechanism for enhancement of heat transfer alternative to the conventional corrugated or slit fins.
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A tube for O-FLEX
  • Proposal and verification of the new heat transfer enhancement mechanism
    We are evaluating a new single phase flow heat transfer enhancement mechanism which can replace the leading edge effect of the conventional slit or louver fins. High performance in heat conductivity, dust resistance and drainage are confirmed.

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